IEC TR 62453-51?20:2017(E) provides information for integrating the CIP? technology into the COM-based implementation of FDT interface specification (IEC TR 62453-41). The Communication Profile Family 2 (commonly known as CIP? defines communication profiles based on IEC 61158?2 Type 2, IEC 61158?3?2, IEC 61158?4?2, IEC 61158?5?2, and IEC 61158?6?2, IEC 62026?3. The basic profiles CP 2/1 (ControlNet?, CP 2/2 (EtherNet/IP?, and CP 2/3 (DeviceNet?1) are defined in IEC 61784?1 and IEC 61784?2. An additional communication profile (CompoNet?),also based on CIP?, is defined in [15]. This document specifies implementation of communication and other services based on IEC 62453?302.
IEC/TR 62453-502:2009(E) is a technical report and provides information for integrating the CIP technology into the COM based implementation of FDT interface specification (IEC/TR 62453-5). Communication Profile Family 2 (commonly known as CIPTM1) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, and IEC 61158-6-2, IEC 62026-3. The basic profiles CP 2/1 (ControlNetTM2), CP 2/2 (EtherNet/IPTM3), and CP 2/3 (DeviceNetTM1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNetTM), also based on CIPTM, is defined in [13]. It neither contains the FDT specification nor modifies it.
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