IEC 61189-11:2013

May 2013

International standard Current

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11 : measurement of melting temperature or melting temperature ranges of solder alloys

Main informations

International IEC standards

May 2013

34 p.

IEC 61189-11:2013

31.180 Printed circuits and boards

1 - 06/06/2013

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