IEC 60194-2:2017
Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
IEC 60194-2:2017(E) covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic technologies.This first edition, together with IEC 60194-1, will cancel and replace IEC 60194:2015. This edition constitutes a technical revision.This edition includes the following significant technical changes with respect to IEC 60194:2015:a) exclusion of 32 general terms better served by other TCs;b) exclusion of 47 terms no longer used by the electronics assembly industry;c) inclusion of 13 new terms related with device embedded substrate technology;d) removal of identification codes for terms as well as annexes.
IEC 60194-2:2017(E) covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic technologies.
This first edition, together with IEC 60194-1, will cancel and replace IEC 60194:2015. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to IEC 60194:2015:
a) exclusion of 32 general terms better served by other TCs;
b) exclusion of 47 terms no longer used by the electronics assembly industry;
c) inclusion of 13 new terms related with device embedded substrate technology;
d) removal of identification codes for terms as well as annexes.
L'IEC 60194:2015 définit la terminologie utilisée dans le domaine des cartes de circuits imprimés et des produits d'assemblage de cartes de circuits imprimés. Les principaux changements par rapport à l'édition précédente sont les suivantes: - Quelque deux cents termes et définitions ont été mis à jour, le cas échéant, et - deux cents nouveaux termes et définitions ont été ajoutés.
IEC 60194-2:2025 covers terms and definitions related to circuit board and electronic assembly technologies as well as other electronic technologies. The terms have been classified according to the decimal classification code (DCC) and this DCC number appears just below the defined term. The DCC numbering is fully explained in Annex A. A list of terms in alphabetical order with code number is provided in Annex B. This edition includes the following significant technical changes with respect to the previous edition: a) exclusion of 116 terms transferred to IEV; b) inclusion of 9 new terms related to printed electronics and packaging technology; c) revision of definitions of 23 terms reflecting current technology; d) three "printed wiring" terms were removed; e) reintroduction of identification codes for terms.
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