applies to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. The contents of the corrigendum of September 2004 have been included in this copy.
is a supplementary document to the sectional specification and contains requirements for style, layout and minimum content of detail specifications. Detail specifications not complying with these requirements may not be considered as being in accordance with IEC specifications nor shall they so be described. The contents of the corrigendum of September 2004 have been included in this copy.
is a supplementary document to the sectional specification and contains requirements for style, layout and minimum content of detail specifications. Detail specifications not complying with these requirements may not be considered as being in accordance with IEC specifications nor shall they so be described. The contents of the corrigendum of September 2004 have been included in this copy.
applies to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. The contents of the corrigendum of September 2004 have been included in this copy.
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