IEC TR 62453-51‑20:2017(E) provides information for integrating the CIP™ technology into the COM-based implementation of FDT interface specification (IEC TR 62453-41). The Communication Profile Family 2 (commonly known as CIP™ defines communication profiles based on IEC 61158‑2 Type 2, IEC 61158‑3‑2, IEC 61158‑4‑2, IEC 61158‑5‑2, and IEC 61158‑6‑2, IEC 62026‑3. The basic profiles CP 2/1 (ControlNet™, CP 2/2 (EtherNet/IP™, and CP 2/3 (DeviceNet™1) are defined in IEC 61784‑1 and IEC 61784‑2. An additional communication profile (CompoNet™),also based on CIP™, is defined in [15]. This document specifies implementation of communication and other services based on IEC 62453‑302.
IEC/TR 62453-502:2009(E) is a technical report and provides information for integrating the CIP technology into the COM based implementation of FDT interface specification (IEC/TR 62453-5). Communication Profile Family 2 (commonly known as CIPTM1) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, and IEC 61158-6-2, IEC 62026-3. The basic profiles CP 2/1 (ControlNetTM2), CP 2/2 (EtherNet/IPTM3), and CP 2/3 (DeviceNetTM1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNetTM), also based on CIPTM, is defined in [13]. It neither contains the FDT specification nor modifies it.
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