DIN EN 62137-4

July 2015

Standard Current

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014) - German version EN 62137-4:2014 + AC:2015 / Note: DIN EN 62137 (2005-04) remains valid alongside this standard until 2017-11-13.

Main informations

Collections

DIN german standards

Publication date

July 2015

Number of pages

44 p.

Reference

DIN EN 62137-4

ICS Codes

31.020 Electronic components in general

31.190 Electronic component assemblies

Print number

Replaced standards (1)

DIN EN 62137

April 2005

Standard Cancelled

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN (IEC 62137:2004 + Corrigendum:2005) - German version EN 62137:2004 / Note: A transition period, as set out in DIN EN 62137-4 (2015-07), exists until 2017-11-13.

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