IEC 60068-2-21:2021

Provides test methods applicable to surface mounting devices made of glass or sintered materials such as capacitors, resistors and inductors incorporating ferrites. Two test methods exist: body strength and impact shock. The object of both tests is to evaluate the mechanical stresses applied to SMDs during and after mounting; these tests look at different mechanical stresses.

IEC 60068-2-21:2006 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations. This edition includes the following significant technical changes with respect to the previous edition: - Addition of torque severity for nominal thread diameter of 8 mm in Test Ud: torque in accordance with IEC 60252-2 (see table 5); - Modification of substrate specification and mounting method describing lead-free solder in Test Ue (see Figure 5 and 8.3.3 et al.); - Modification of test jig and test condition in Test Ue1: substrate bending test (see Figure 7 et al.); - Change of pushing force from 10 N to 5 N in Test Ue3: shear test (see 8.5.3.2). The contents of the corrigendum of January 2012 have been included in this copy.