IEC 60068-2-58:1989
IEC 60068-2-58:1989

IEC 60068-2-58:1989

August 1989
International standard Cancelled

Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)

Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.

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International IEC standards

Publication date

August 1989

Number of pages

25 p.

Reference

IEC 60068-2-58:1989

Print number

1
Sumary
Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)

Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.
Standard replaced by (1)
IEC 60068-2-58:1999
IEC 60068-2-58:1999
January 1999
International standard Cancelled
Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.

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