IEC 60191-4:2013
Collections
International IEC standards
Publication date
October 2013
Number of pages
48 p.
Reference
IEC 60191-4:2013
IEC 60191-4:2013
October 2013
International standard
Current
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:a) Material code "S" is added to indicate a silicon based package.b) Description of "WL" is added to be used for general use.
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Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.
IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.
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Replaced standards
(3)
IEC 60191-4:1999
October 1999
International standard
Cancelled
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages.
IEC 60191-4:1999/AMD1:2001
November 2001
International standard
Cancelled
Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
IEC 60191-4:1999/AMD2:2002
July 2002
International standard
Cancelled
Amendment 2 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
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