IEC 60191-6-1:2001

IEC 60191-6-1:2001

October 2001
International standard Current

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

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Main informations

Collections

International IEC standards

Publication date

October 2001

Number of pages

7 p.

Reference

IEC 60191-6-1:2001

Print number

1 - 13/06/2005
Sumary
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)
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