IEC 60191-6-21:2010
Collections
International IEC standards
Publication date
August 2010
Number of pages
28 p.
Reference
IEC 60191-6-21:2010
IEC 60191-6-21:2010
August 2010
International standard
Current
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
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Sumary
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
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