IEC 60194:2015
Printed board design, manufacture and assembly - Terms and definitions
IEC 60194:2015 defines the terminology used in the field of printed circuit boards and printed circuit board assembly products. The main changes with respect to the previous edition are the following:- Some two hundred terms and definitions have been updated, where applicable, and- another two hundred new terms and definitions have been added.
IEC 60194:2015 defines the terminology used in the field of printed circuit boards and printed circuit board assembly products. The main changes with respect to the previous edition are the following:
- Some two hundred terms and definitions have been updated, where applicable, and
- another two hundred new terms and definitions have been added.
This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.
IEC 60194-2:2017(E) covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic technologies. This first edition, together with IEC 60194-1, will cancel and replace IEC 60194:2015. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to IEC 60194:2015: a) exclusion of 32 general terms better served by other TCs; b) exclusion of 47 terms no longer used by the electronics assembly industry; c) inclusion of 13 new terms related with device embedded substrate technology; d) removal of identification codes for terms as well as annexes.
IEC 60194-1:2021 covers terms and definitions closely related with TC91 technology. This document, together with IEC 60194-2:2017, cancel and replace IEC 60194:2015. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: 1) exclusion of 32 general terms better served by other TCs; 2) exclusion of 47 terms no longer used by the electronic assembly industry; 3) inclusion of 14 new terms related with device embedded substrate technology; 4) inclusion of 113 synonymous terms; 5) removal of identification codes for terms and annexes.
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