IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition:a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes);b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).
IEC 60286-3-1:2009 is applicable to the taping of surface mount components using carrier tapes which have concave cavities formed by compression of the base material.
IEC 60286-3-2:2009 is applicable to the tape packing of ultra small surface mount components using plastic blister carrier tape of 4 mm in width which has concave cavities for containing components of 1 mm in pitch of the component compartments (W4P1).
IEC 60286-3:2007 is applicable to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This fourth edition cancels and replaces the third edition issued in 1997. It constitutes a technical revision. It contains the following significant technical changes with respect to the previous edition: a) implementation of Type IV (adhesive-backed punched plastic carrier tape for singulated bare die and other surface mount components); b) minor revisions related to tables, figures and references.
IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition: - addition of a table of the classification to symbols concerning tape, reel and common symbols; - additions of a figure of example of polarity and orientation and a figure of example of dot seal; - revision of requirements for camber; - addition of a definition of design value with regard to tilt.
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