This amendment 1 is valid for the following parts of the IEC 60317: Part 2 (1990), Part 3 (1990), Part 4 (1990), Part 10 (1972), Part 12 (1990), Part 14 (1990), Part 15 (1990), Part 16 (1990), Part 17 (1990), Part 18 (1990), Part 19 (1990), Part 20 (1990), Part 21 (1990), Part 22 (1990), Part 23 (1990), Part 24 (1990), Part 26 (1990), Part 28 (1990), Part 29 (1990), Part 30 (1990), Part 35 (1992), Part 36 (1992), Part 37 (1992) and Part 38 (1992).
IEC 60317-2:2012 specifies the requirements of solderable enamelled round copper winding wire of class 130 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. This edition includes the following significant technical changes with respect to the previous edition: - addition of requirements for appearance, new subclause 3.3 and - addition of pin hole test requirements, Clause 23: Pin hole test. Keywords: copper winding wire This publication is to be read in conjunction with IEC 60317-0-1:2008.
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