IEC 60317-35:2013
Collections
International IEC standards
Publication date
October 2013
Number of pages
24 p.
Reference
IEC 60317-35:2013
IEC 60317-35:2013
October 2013
International standard
Current
Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer
IEC 60317-35:2013 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on poly-urethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is:- Grade 1B: 0,020 mm up to and including 0,800 mm;- Grade 2B: 0,020 mm up to and including 0,800 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 1992, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:- new 3.2.2 containing general notes on winding wire, formerly a part of the scope;- revision to references to IEC 60317-0-1:2013 to clarify that their application is normative;- modification to Clause 15 to remove specific wire specimen sizes;- consolidation of 17.1 and 17.2 of the solderability requirements;- new Clause 23, Pin hole test. Key words: requirements of solderable enamelled round copper winding wire, class 155, dual coating
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Sumary
Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer
IEC 60317-35:2013 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on poly-urethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is:
- Grade 1B: 0,020 mm up to and including 0,800 mm;
- Grade 2B: 0,020 mm up to and including 0,800 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 1992, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- new 3.2.2 containing general notes on winding wire, formerly a part of the scope;
- revision to references to IEC 60317-0-1:2013 to clarify that their application is normative;
- modification to Clause 15 to remove specific wire specimen sizes;
- consolidation of 17.1 and 17.2 of the solderability requirements;
- new Clause 23, Pin hole test. Key words: requirements of solderable enamelled round copper winding wire, class 155, dual coating
IEC 60317-35:2013 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on poly-urethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is:
- Grade 1B: 0,020 mm up to and including 0,800 mm;
- Grade 2B: 0,020 mm up to and including 0,800 mm. The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013. This second edition cancels and replaces the first edition published in 1992, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- new 3.2.2 containing general notes on winding wire, formerly a part of the scope;
- revision to references to IEC 60317-0-1:2013 to clarify that their application is normative;
- modification to Clause 15 to remove specific wire specimen sizes;
- consolidation of 17.1 and 17.2 of the solderability requirements;
- new Clause 23, Pin hole test. Key words: requirements of solderable enamelled round copper winding wire, class 155, dual coating
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Replaced standards
(3)
IEC 60317-35:1992/AMD2:1999
October 1999
International standard
Cancelled
Amendment 2 - Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer
IEC 60317-35:1992
July 1992
International standard
Cancelled
Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer
IEC 60317-35:1992/AMD1:1997
December 1997
International standard
Cancelled
Amendment 1 - Specifications for particular types of winding wires - Part 35: Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer
This amendment 1 is valid for the following parts of the IEC 60317: Part 2 (1990), Part 3 (1990), Part 4 (1990), Part 10 (1972), Part 12 (1990), Part 14 (1990), Part 15 (1990), Part 16 (1990), Part 17 (1990), Part 18 (1990), Part 19 (1990), Part 20 (1990), Part 21 (1990), Part 22 (1990), Part 23 (1990), Part 24 (1990), Part 26 (1990), Part 28 (1990), Part 29 (1990), Part 30 (1990), Part 35 (1992), Part 36 (1992), Part 37 (1992) and Part 38 (1992).
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