IEC 60384-19:1993

IEC 60384-19:1993

June 1993
International standard Cancelled

Fixed capacitors for use in electronic equipment - Part 19: Sectional specification: Fixed metallized polyethylene-terephthalate film dielectric chip d.c. capacitors

Prescribes preferred ratings and characteristics. Selects from IEC 384-1 (1982) the appropriate quality assessment procedures, tests and measuring methods. Gives general perfomance requirements for this type of capacitor.

Main informations

Collections

International IEC standards

Publication date

June 1993

Number of pages

53 p.

Reference

IEC 60384-19:1993

Print number

1
Sumary
Fixed capacitors for use in electronic equipment - Part 19: Sectional specification: Fixed metallized polyethylene-terephthalate film dielectric chip d.c. capacitors

Prescribes preferred ratings and characteristics. Selects from IEC 384-1 (1982) the appropriate quality assessment procedures, tests and measuring methods. Gives general perfomance requirements for this type of capacitor.
Standard replaced by (1)
IEC 60384-19:2006
January 2006
International standard Cancelled
Fixed capacitors for use in electronic equipment - Part 19: Sectional specification: Fixed metallized polyethylene-terephthalate film dielectric surface mount d.c. capacitors

IEC 60384-19:2006 is applicable to fixed surface mount capacitors for direct current, with metallized electrodes and polyethylene-terephthalate dielectric for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted direct onto substrates for hybrid circuits or onto printed boards. These capacitors may have "self-healing properties" depending on conditions of use. They are primarily intended for applications where the a.c. component is small with respect to the rated voltage. This second edition cancels and replaces the first edition published in 1993 and constitutes minor revisions related to tables, figures and references. This bilingual version (2012-03) corresponds to the monolingual English version, published in 2006-01.

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