IEC 60691:1993
IEC 60691:1993

IEC 60691:1993

April 1993
International standard Cancelled

Thermal-links - Requirements and application guide

Applies to thermal-links, intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. May be applicable to thermal-links for use under other than indoor conditions, provided that the climatic and other circum- stances in the immediate surroundings of such thermal-links are comparable with those in this standard.

Main informations

Collections

International IEC standards

Publication date

April 1993

Number of pages

43 p.

Reference

IEC 60691:1993

ICS Codes

29.120.50   Fuses and other overcurrent protection devices

Print number

1
Sumary
Thermal-links - Requirements and application guide

Applies to thermal-links, intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. May be applicable to thermal-links for use under other than indoor conditions, provided that the climatic and other circum- stances in the immediate surroundings of such thermal-links are comparable with those in this standard.
Replaced standards (1)
IEC 60691:1980
IEC 60691:1980
January 1980
International standard Cancelled
Thermal-links

Standard replaced by (1)
IEC 60691:2002
IEC 60691:2002
December 2002
International standard Cancelled
Thermal-links - Requirements and application guide

Applies to thermal-links, intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. May be applicable to thermal-links for use under other than indoor conditions, provided that the climatic and other circumstances in the immediate surroundings of such thermal-links are comparable with those in this standard.

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