IEC 60691:2015/AMD1:2019

IEC 60691:2015/AMD1:2019

January 2019
International standard Cancelled

Amendment 1 - Thermal-links - Requirements and application guide

Main informations

Collections

International IEC standards

Publication date

January 2019

Number of pages

5 p.

Reference

IEC 60691:2015/AMD1:2019

Print number

4
Standard replaced by (1)
IEC 60691:2023
March 2023
International standard Current
Thermal-links - Requirements and application guide

IEC 60691:2023 is applicable to thermal-links intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. NOTE 1?The equipment is not designed to generate heat. NOTE 2?The effectiveness of the protection against excessive temperatures logically depends upon the position and method of mounting of the thermal-link, as well as upon the current which it is carrying. This document may be applicable to thermal-links for use under conditions other than indoors, provided that the climatic and other circumstances in the immediate surroundings of such thermal-links are comparable with those in this standard. This document may be applicable to thermal-links in their simplest forms (e.g. melting strips or wires), provided that molten materials expelled during function cannot adversely interfere with the safe use of the equipment, especially in the case of hand-held or portable equipment, irrespective of its position.

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