IEC 60749-15:2003
Collections
International IEC standards
Publication date
February 2003
Number of pages
11 p.
Reference
IEC 60749-15:2003
Print number
1
IEC 60749-15:2003
February 2003
International standard
Cancelled
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
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Sumary
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
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Standard replaced by
(1)
IEC 60749-15:2010
October 2010
International standard
Cancelled
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: - editorial change in the scope; - addition of lead-free solder chemical composition specification.
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