IEC 60749-20:2002/COR1:2003

IEC 60749-20:2002/COR1:2003

August 2003
International standard Cancelled

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Modification of the validity date: now put at 2007.

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Main informations

Collections

International IEC standards

Publication date

August 2003

Number of pages

0 p.

Reference

IEC 60749-20:2002/COR1:2003

Print number

1
Sumary
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Modification of the validity date: now put at 2007.
Standard replaced by (1)
IEC 60749-20:2008
December 2008
International standard Cancelled
Semiconductor devices - Mechanical and climatic test methods - Part 20 : resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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