IEC 60749-22:2002
Collections
International IEC standards
Publication date
September 2002
Number of pages
41 p.
Reference
IEC 60749-22:2002
IEC 60749-22:2002
September 2002
International standard
Current
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.
Main informations
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Sumary
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.
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