IEC 60749-4:2002/COR1:2003

IEC 60749-4:2002/COR1:2003

August 2003
International standard Cancelled

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

Modification of the validity date: now put at 2007.

Main informations

Collections

International IEC standards

Publication date

August 2003

Number of pages

0 p.

Reference

IEC 60749-4:2002/COR1:2003

Print number

1 - 13/06/2005
Sumary
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

Modification of the validity date: now put at 2007.
Standard replaced by (1)
IEC 60749-4:2017
March 2017
International standard Current
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

IEC 60749-4:2017 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments. This edition includes the following significant technical changes with respect to the previous edition: a) clarification of requirements for temperature, relative humidity and duration detailed in Table 1; b) recommendations that current limiting resistor(s) be placed in the test set-up to prevent test board or DUT damage; c) allowance of additional time-to-test delay or return-to-stress delay.

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