IEC 60749-7:2002
Collections
International IEC standards
Publication date
April 2002
Number of pages
15 p.
Reference
IEC 60749-7:2002
Print number
1
IEC 60749-7:2002
April 2002
International standard
Cancelled
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
Aims at testing and measuring the water vapour and other gas content of the atmosphere inside a metal or ceramic hermetically sealed device. Applicable to semiconductor devices sealed in such a manner but generally only used for high reliability applications such as military or aerospace.The contents of the corrigendum of August 2003 have been included in this copy.
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Sumary
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
Aims at testing and measuring the water vapour and other gas content of the atmosphere inside a metal or ceramic hermetically sealed device. Applicable to semiconductor devices sealed in such a manner but generally only used for high reliability applications such as military or aerospace. The contents of the corrigendum of August 2003 have been included in this copy.
Aims at testing and measuring the water vapour and other gas content of the atmosphere inside a metal or ceramic hermetically sealed device. Applicable to semiconductor devices sealed in such a manner but generally only used for high reliability applications such as military or aerospace. The contents of the corrigendum of August 2003 have been included in this copy.
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Standard replaced by
(1)
IEC 60749-7:2011
June 2011
International standard
Current
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
IEC 60749-7:2011 specifies the testing and measurement of water vapour and other gas content of the atmosphere inside a metal or ceramic hermetically sealed device. The test is used as a measure of the quality of the sealing process and to provide information about the long-term chemical stability of the atmosphere inside the package. It is applicable to semiconductor devices sealed in such a manner but generally only used for high reliability applications such as military or aerospace. This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. This second edition has been completely re-written so as to align it with the text of the latest versions of MIL-STD-750, method 1018 and MIL-STD-883, method 1018. The main change is the removal of the two alternative methods formerly designated method 2 and method 3.
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