IEC 61188-5-8:2007

IEC 61188-5-8:2007

October 2007
International standard Current

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.This publication is to be read in conjunction with IEC 61188-5-1:2002.

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Main informations

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International IEC standards

Publication date

October 2007

Number of pages

30 p.

Reference

IEC 61188-5-8:2007

Print number

1 - 04/01/2008
Sumary
Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.

This publication is to be read in conjunction with IEC 61188-5-1:2002.
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