IEC 61189-1:1997+AMD1:2001 CSV

November 2001

International standard Current

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies. This consolidated version consists of the first edition (1997) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication.

Main informations

Collections

International IEC standards

Publication date

November 2001

Number of pages

51 p.

Reference

IEC 61189-1:1997+AMD1:2001 CSV

Print number

1 - 13/06/2005

Sumary

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies. This consolidated version consists of the first edition (1997) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication.

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