IEC 61189-3:2007

October 2007

International standard Current

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

IEC 61189-3:2007 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major technical changes with regard to the previous edition concern the addition of 25 new tests, as follows:- 6 V: Visual test methods: 3V01, 3V02 and 3V03;- 7 D: Dimensional test methods: 3D03;- 8 C: Chemical test methods: 3C02, 3C13 and 3C14;- 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09;- 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18;- 11 N: Environmental test methods: 3N03, 3N07 and 3N12;- 12 X: Miscellaneous test methods: 3X01.

Main informations

Collections

International IEC standards

Publication date

October 2007

Number of pages

118 p.

Reference

IEC 61189-3:2007

Print number

2 - 07/11/2007

Sumary

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

IEC 61189-3:2007 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major technical changes with regard to the previous edition concern the addition of 25 new tests, as follows:
- 6 V: Visual test methods: 3V01, 3V02 and 3V03;
- 7 D: Dimensional test methods: 3D03;
- 8 C: Chemical test methods: 3C02, 3C13 and 3C14;
- 9 M: Mechanical test methods: 3M01, 3M03, 3M04, 3M07 and 3M09;
- 10 E: Electrical test methods: 3E03, 3E04, 3E05, 3E11, 3E12, 3E13, 3E16, 3E17 and 3E18;
- 11 N: Environmental test methods: 3N03, 3N07 and 3N12;
- 12 X: Miscellaneous test methods: 3X01.

Replaced standards (2)

IEC 61189-3:1997/AMD1:1999

July 1999

International standard Cancelled

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

IEC 61189-3:1997

April 1997

International standard Cancelled

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods.

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