IEC 61190-1-1:2002

March 2002

International standard Current

Attachment materials for electronic assembly - Part 1-1 : requirements for soldering fluxes for high-quality interconnections in electronics assembly

Main informations

International IEC standards

March 2002

41 p.

IEC 61190-1-1:2002

31.190 Electronic component assemblies

1 - 13/06/2005

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