IEC 61190-1-1:2002

IEC 61190-1-1:2002

March 2002
International standard Current

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

Main informations

Collections

International IEC standards

Publication date

March 2002

Number of pages

41 p.

Reference

IEC 61190-1-1:2002

ICS Codes

31.190   Electronic component assemblies
Sumary
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
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