IEC 61192-4:2002

IEC 61192-4:2002

November 2002
International standard Cancelled

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.

Main informations

Collections

International IEC standards

Publication date

November 2002

Number of pages

59 p.

Reference

IEC 61192-4:2002

Print number

1 - 13/06/2005
Sumary
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.
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