IEC 61192-5:2007

May 2007

International standard Cancelled

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

IEC 61192-5:2007 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. It also contains guidance on design matters where they have relevance to rework.

Main informations

Collections

International IEC standards

Publication date

May 2007

Number of pages

38 p.

Reference

IEC 61192-5:2007

Print number

1 - 03/07/2007

Sumary

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

IEC 61192-5:2007 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. It also contains guidance on design matters where they have relevance to rework.

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