IEC 61249-5-1:1995

November 1995

International standard Current

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

Gives requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards.

Main informations

Collections

International IEC standards

Publication date

November 1995

Number of pages

39 p.

Reference

IEC 61249-5-1:1995

Print number

1 - 13/06/2005

Sumary

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

Gives requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards.

Replaced standards (1)

IEC 60249-3A:1976/COR1:1980

January 1976

International standard Cancelled

Corrigendum 1 - First supplement: Metal-clad base materials for printed circuits - Specification No. 2: Specification for copper foil for use in the manufacture of copper clad base materials

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