IEC 61709:1996
Collections
International IEC standards
Publication date
October 1996
Number of pages
83 p.
Reference
IEC 61709:1996
Print number
1
IEC 61709:1996
October 1996
International standard
Cancelled
Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion
Gives guidance on the use of failure rate data for the reliabilityprediction of components in electronic equipment. Referenceconditions for failure rate data are specified, so that data fromdifferent sources can be compared. The reference conditions adoptedare typical of the majority of applications of components inequipment (e.g. telecommunication use, data processing). In thisstandard it is assumed that the failure rate used under referenceconditions is specific to the component i.e. it includes the effectof complexity, technology of the casing, dependence onmanufacturers and the manufacturing process, etc.
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Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion
Gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared. The reference conditions adopted are typical of the majority of applications of components in equipment (e.g. telecommunication use, data processing). In this standard it is assumed that the failure rate used under reference conditions is specific to the component i.e. it includes the effect of complexity, technology of the casing, dependence on manufacturers and the manufacturing process, etc.
Gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared. The reference conditions adopted are typical of the majority of applications of components in equipment (e.g. telecommunication use, data processing). In this standard it is assumed that the failure rate used under reference conditions is specific to the component i.e. it includes the effect of complexity, technology of the casing, dependence on manufacturers and the manufacturing process, etc.
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Standard replaced by
(1)
IEC 61709:2011
June 2011
International standard
Cancelled
Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
IEC 61709:2011 gives guidance on how failure rate data can be employed for reliability prediction of electric components in equipment. Reference conditions are numerical values of stresses that are typically observed by components in the majority of applications. Reference conditions are useful since they are the basis of the calculation of failure rate under any conditions by the application of stress models that take into account the actual operating conditions. This standard also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. This edition includes the following significant technical changes with respect to the previous edition: - the addition of a number of component types and the updating of models for a large number of component types; - the addition of annexes on reliability prediction, sources of failure rate data and component classification information.
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