IEC 61837-2:2018

IEC 61837-2:2018

May 2018
International standard Current

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures

IEC 61837-2:2018 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016.This edition includes the following significant technical changes with respect to the previous edition:a. revision of the figures to match the notation of the drawings of IEC 61240:2016;b. addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.

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Main informations

Collections

International IEC standards

Publication date

May 2018

Number of pages

99 p.

Reference

IEC 61837-2:2018

Print number

3
Sumary
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures

IEC 61837-2:2018 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016.
This edition includes the following significant technical changes with respect to the previous edition:
a. revision of the figures to match the notation of the drawings of IEC 61240:2016;
b. addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
Replaced standards (2)
IEC 61837-2:2011
May 2011
International standard Cancelled
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures

IEC 61837-2:2011 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240. In this edition, types of enclosures are renamed to express their features in their names for better understanding. The relative comparison of new types with old ones is listed in Table 1. New names of enclosures express configuration type, terminal lead numbers, sizes and arrangement of terminal pads. The details of definition are shown in Clause 3: Configuration of enclosures, and Clause 4: Designation of types. Enclosures in this new edition are based on IEC 61240. In this standard, 27 enclosures are added to the first edition of IEC 61837-2. This publication is to be read in conjunction with IEC 61240:1994.

IEC 61837-2:2011/AMD1:2014
March 2014
International standard Cancelled
Amendment 1 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures

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