IEC 61967-8:2023

IEC 61967-8:2023

May 2023
International standard Current

Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method

IEC 61967-8:2023 defines a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline. The IC being evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement. This edition includes the following significant technical changes with respect to the previous edition:a) frequency range of 150 kHz to 3 GHz was deleted from the scope;b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements are fulfilled.

Main informations

Collections

International IEC standards

Publication date

May 2023

Number of pages

34 p.

Reference

IEC 61967-8:2023
Sumary
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method

IEC 61967-8:2023 defines a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline. The IC being evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement. This edition includes the following significant technical changes with respect to the previous edition:
a) frequency range of 150 kHz to 3 GHz was deleted from the scope;
b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements are fulfilled.
Replaced standards (1)
IEC 61967-8:2011
August 2011
International standard Cancelled
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method

IEC 61967-8:2011 defines a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline in the frequency range of 150 kHz up to 3 GHz. The IC being evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement. This publication is to be read in conjunction with IEC 61967-1:2002.

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