IEC 62258-6:2006

IEC 62258-6:2006

August 2006
International standard Current

Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2

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Main informations

Collections

International IEC standards

Publication date

August 2006

Number of pages

9 p.

Reference

IEC 62258-6:2006

Print number

1 - 05/10/2006
Sumary
Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
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