IEC 62899-202-5:2018

September 2018

International standard Current

Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.

Main informations

Collections

International IEC standards

Publication date

September 2018

Number of pages

15 p.

Reference

IEC 62899-202-5:2018

Print number

Sumary

Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.

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