IEC PAS 60191-6-19:2008

IEC PAS 60191-6-19:2008

January 2008
Publicly available specification Cancelled

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.

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Main informations

Collections

International IEC standards

Publication date

January 2008

Number of pages

22 p.

Reference

IEC PAS 60191-6-19:2008

Print number

1
Sumary
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.
Standard replaced by (1)
IEC 60191-6-19:2010
February 2010
International standard Current
Mechanical standardization of semiconductor devices - Part 6-19 : measurement methods of package warpage at elevated temperature and the maximum permissible warpage

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