IEC PAS 62206:2000

November 2000

Publicly available specification Cancelled

Power and temperature cycling

Aims at determining the ability of a device to withstand alternate exposures at high and low temperature extremes with operating biases periodically applied and removed. It is intended to simulate worst case conditions encountered in typical applications and considered destructive.

Main informations

Collections

International IEC standards

Publication date

November 2000

Number of pages

5 p.

Reference

IEC PAS 62206:2000

Print number

Sumary

Power and temperature cycling

Aims at determining the ability of a device to withstand alternate exposures at high and low temperature extremes with operating biases periodically applied and removed. It is intended to simulate worst case conditions encountered in typical applications and considered destructive.

Standard replaced by (1)

IEC 60749-34:2004

March 2004

International standard Cancelled

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.

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