IEC TR 61000-1-3:2002
Electromagnetic compatibility (EMC) - Part 1-3: General - The effects of high-altitude EMP (HEMP) on civil equipment and systems
The purpose of this Technical Report is to describe the effects that have occurred during actual and simulated electromagnetic pulse testing throughout the world. These effects include those observed during the high-altitude nuclear tests conducted by the United States and the Soviet Union in 1962, and the HEMP simulator tests conducted by many countries during the years after atmospheric testing ended. In addition to direct effects, this technical report also contains information on HEMP coupling to "long lines" as it is important to verify that particular levels of currents and voltages can be induced by HEMP on these lines; this provides a basis for direct injection testing of electronic equipment. It should be noted that, in most cases, the electrical equipment tested or exposed did not contain the sensitive electronics in use today. Also it should be emphasized that all tests and exposures did not produce failure of the equipment; factors such as the geometry of the HEMP interaction and the electromagnetic shielding of the equipment are variables that can produce differing results. The description of these effects is intended to illustrate the seriousness of the possible effects of HEMP on modern electronic systems.
The purpose of this Technical Report is to describe the effects that have occurred during actual and simulated electromagnetic pulse testing throughout the world. These effects include those observed during the high-altitude nuclear tests conducted by the United States and the Soviet Union in 1962, and the HEMP simulator tests conducted by many countries during the years after atmospheric testing ended. In addition to direct effects, this technical report also contains information on HEMP coupling to "long lines" as it is important to verify that particular levels of currents and voltages can be induced by HEMP on these lines; this provides a basis for direct injection testing of electronic equipment. It should be noted that, in most cases, the electrical equipment tested or exposed did not contain the sensitive electronics in use today. Also it should be emphasized that all tests and exposures did not produce failure of the equipment; factors such as the geometry of the HEMP interaction and the electromagnetic shielding of the equipment are variables that can produce differing results. The description of these effects is intended to illustrate the seriousness of the possible effects of HEMP on modern electronic systems.
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