IEC TS 62804-1-1:2020

IEC TS 62804-1-1:2020

January 2020
Technical specification Current

Photovoltaic (PV) modules - Test methods for the detection of potential-induced degradation - Part 1-1: Crystalline silicon - Delamination

IEC 62804-1-1:2020 defines procedures to test and evaluate for potential-induced degradation-delamination (PID-d) mode in the laminate of crystalline silicon PV modules-principally those with one or two glass faces. This document evaluates delamination attributable to current transfer between ground and the module cell circuit. Elements driving the delamination that this test is designed to actuate include reduced adhesion associated with damp heat exposure, sodium accumulation at interfaces, and cathodic gas evolution in the cell circuit, metallization, and other components within the PV module activated by the voltage potential. The change in power of crystalline silicon PV modules associated with the stress factors applied (the purview of IEC TS 62804-1) is not considered in the scope.

Main informations

Collections

International IEC standards

Publication date

January 2020

Number of pages

16 p.

Reference

IEC TS 62804-1-1:2020

Print number

1
Sumary
Photovoltaic (PV) modules - Test methods for the detection of potential-induced degradation - Part 1-1: Crystalline silicon - Delamination

IEC 62804-1-1:2020 defines procedures to test and evaluate for potential-induced degradation-delamination (PID-d) mode in the laminate of crystalline silicon PV modules-principally those with one or two glass faces. This document evaluates delamination attributable to current transfer between ground and the module cell circuit. Elements driving the delamination that this test is designed to actuate include reduced adhesion associated with damp heat exposure, sodium accumulation at interfaces, and cathodic gas evolution in the cell circuit, metallization, and other components within the PV module activated by the voltage potential. The change in power of crystalline silicon PV modules associated with the stress factors applied (the purview of IEC TS 62804-1) is not considered in the scope.
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