Soft solder alloys. Chemical compositions and forms.

Main informations

Collections

National standards and national normative documents

Publication date

February 1994

Number of pages

4 p.

Reference

NF EN 29453

ICS Codes

25.160.50 Brazing and soldering

Classification index

A81-363

Print number

1 - 01/03/1994

International kinship

ISO 9453:1990

European kinship

EN 29453:1993

Standard replaced by (1)

NF EN ISO 9453

February 2007

Standard Cancelled

Soft solder alloys - Chemical compositions and forms

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;tin-antimony;tin-bismuth;tin-copper, with and without silver;tin-indium, with and without silver and bismuth;tin-silver, with and without copper and bismuth;tin-zinc, with and without bismuth. ISO 9453:2006 also includes an indication of the forms generally available.

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