NF EN 60749-15

Semiconductor devices - Mechanical and climatic test methods - Part 15 : resistance to soldering temperature for through-hole mounted devices

Le présent document décrit un essai utilisé pour déterminer si les dispositifs à semiconducteurs, encapsulés, utilisés pour le montage par trous traversants, peuvent résister aux effets de la température à laquelle ils sont soumis pendant le soudage de leurs sorties, en utilisant le brasage tendre à la vague ou le fer à braser.

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