NF EN 60749-19

Semiconductor devices - Mechanical and climatic test methods - Part 19 : die shear strength

Le présent document détermine la cohérence des matériaux et des méthodes d'essais utilisées pour fixer les pastilles à semiconducteurs aux embases de boîtiers ou autres substrats (le terme "pastille à semiconducteurs" doit être considéré comme incluant les éléments passifs pour cette méthode d'essais).

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