NF EN 62047-16

Semiconductor devices - Micro-electromechanical devices - Part 16 : test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

Le présent document définit les méthodes d'essai permettant de mesurer les contraintes résiduelles des films dont l'épaisseur se situe dans la plage de 0,01 micron m à 10 micron m dans des structures fabriquées de microsystèmes électromécaniques (MEMS) au moyen des méthodes de la courbure de la plaquette ou de déviation de poutre en porte-à-faux.

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