Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Le présent document spécifie les méthodes d'essai et les principes pour évaluer la qualité et la fiabilité des cartes, des zones de report, du processus de brasage, et des joints de soudure du procédé de refusion des boîtiers de type matriciel et des boîtiers de type à bornes périphériques (QFN et SON).

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Main informations

Collections

National standards and national normative documents

Publication date

June 2005

Number of pages

31 p.

Reference

NF EN 62137

ICS Codes

31.020 Electronic components in general

31.190 Electronic component assemblies

Classification index

C93-704

Print number

1 - 23/06/2005

International kinship

IEC 62137:2004

European kinship

EN 62137:2004

Sumary

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Le présent document spécifie les méthodes d'essai et les principes pour évaluer la qualité et la fiabilité des cartes, des zones de report, du processus de brasage, et des joints de soudure du procédé de refusion des boîtiers de type matriciel et des boîtiers de type à bornes périphériques (QFN et SON).

Standard replaced by (1)

NF EN 62137-4

July 2015

Standard Current

Electronics assembly technology - Part 4 : endurance test methods for solder joint of area array type package surface mount devices

Le présent document spécifie la méthode d'essai des joints brasés des boîtiers de type matriciel montés sur la carte de câblage imprimé, visant à évaluer la durabilité des joints brasés par rapport aux contraintes thermiques et mécaniques.

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