NF EN IEC 60749-15
NF EN IEC 60749-15

NF EN IEC 60749-15

September 2020
Standard Current

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Le présent document décrit un essai utilisé pour déterminer si les dispositifs à semiconducteurs encapsulés utilisés pour le montage par trous traversants peuvent résister aux effets de la température à laquelle ils sont soumis pendant le brasage de leurs broches en utilisant le brasage à la vague.

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Main informations

Collections

National standards and national normative documents

Publication date

September 2020

Number of pages

13 p.

Reference

NF EN IEC 60749-15

ICS Codes

31.080.01   Semiconductor devices in general

Print number

1

International kinship

IEC 60749-15:2020

European kinship

EN IEC 60749-15:2020
Sumary
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Le présent document décrit un essai utilisé pour déterminer si les dispositifs à semiconducteurs encapsulés utilisés pour le montage par trous traversants peuvent résister aux effets de la température à laquelle ils sont soumis pendant le brasage de leurs broches en utilisant le brasage à la vague.
Replaced standards (1)
NF EN 60749-15
NF EN 60749-15
April 2011
Standard Cancelled
Semiconductor devices - Mechanical and climatic test methods - Part 15 : resistance to soldering temperature for through-hole mounted devices

Le présent document décrit un essai utilisé pour déterminer si les dispositifs à solide encapsulés utilisés pour le montage par trous traversants peuvent résister aux effets de la température à laquelle ils sont soumis pendant le soudage de leurs sorties en utilisant le brasage tendre à la vague ou le fer à braser.

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