NF EN IEC 61189-3-302
NF EN IEC 61189-3-302

NF EN IEC 61189-3-302

November 2025
Standard Current

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Main informations

Collections

National standards and national normative documents

Publication date

November 2025

Number of pages

21 p.

Reference

NF EN IEC 61189-3-302

ICS Codes

31.180   Printed circuits and boards

International kinship

IEC 61189-3-302:2025 ED1

European kinship

EN IEC 61189-3-302:2025
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