IEC 61249-3-5:1999

February 1999

International standard Current

Materials for printed boards and other interconnecting structures - Part 3-5 : sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

Main informations

International IEC standards

February 1999

12 p.

IEC 61249-3-5:1999

31.180 Printed circuits and boards

1 - 13/06/2005

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