IEC 60249-1:1982/AMD3:1991

January 1991

International standard Cancelled

Amendment 3 - Base materials for printed circuits. Part 1: Test methods

Main informations

Collections

International IEC standards

Publication date

January 1991

Number of pages

15 p.

Reference

IEC 60249-1:1982/AMD3:1991

Print number

Standard replaced by (1)

IEC 61189-2:1997

April 1997

International standard Cancelled

Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

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