IEC 61189-2:1997
Collections
International IEC standards
Publication date
April 1997
Number of pages
139 p.
Reference
IEC 61189-2:1997
Print number
1
IEC 61189-2:1997
April 1997
International standard
Cancelled
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.
Main informations
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Sumary
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.
See more
Voir moins
Standard replaced by
(1)
IEC 61189-2:2006
May 2006
International standard
Current
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2 : test methods for materials for interconnection structures
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