IEC 61189-2:2006

May 2006

International standard Current

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Main informations

Collections

International IEC standards

Publication date

May 2006

Number of pages

122 p.

Reference

IEC 61189-2:2006

ICS Codes

31.180 Printed circuits and boards

Print number

1 - 23/06/2006

Sumary

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Replaced standards (2)

IEC 61189-2:1997/AMD1:2000

January 2000

International standard Cancelled

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

IEC 61189-2:1997

April 1997

International standard Cancelled

Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

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